HR 5287 China Advanced Technology Monitoring Act 2025 (Annual report on the advanced semiconductor manufacturing capabilities of China)

• Authority: United States Congress
• Parent authority: Federal government
• Jurisdiction: United States
• Collections: U.S. federal laws
• Most recent activity: Proposed
• Most recent activity date: 2025-09-10

Risk subdomain coverage

Good coverage — Comprehensive governance measures or mitigations with clear procedures relating to the risk subdomain are explicitly described.

• Competitive dynamics

Minimal coverage — Brief mention but no specific mitigations, recommendations or governance measures relating to the risk subdomain are described.

• AI system security vulnerabilities
• Disinformation, surveillance, and influence at scale
• Cyberattacks, weapon development or use
• Power centralization and unfair distribution
• Governance failure
• AI possessing dangerous capabilities

All other risk subdomains had no coverage in this document.

Risk Coverage Summary

The document primarily addresses competitive dynamics (6.4) in semiconductor and AI technology development between the US and China, with implicit coverage of security vulnerabilities (2.2), malicious actor risks (4.1, 4.2), power centralization (6.1), governance effectiveness (6.5), and dangerous capabilities (7.2). Coverage focuses on strategic technology competition and export control effectiveness rather than specific AI system risks.

Sector coverage

Good coverage — Comprehensive governance measures or mitigations with clear procedures relating to the sector are explicitly described.

• Agriculture, Mining, Construction & Manufacturing
• Information
• National Security

Minimal coverage — Brief mention but no specific mitigations, recommendations or governance measures relating to the sector are described.

• Professional & Technical Services
• Scientific Research & Development Services

All other sectors had no coverage in this document.

Sectors Summary

This document primarily governs National Security activities (monitoring and assessing strategic technology competition), with strong coverage of the Information sector (semiconductor and AI chipmaking infrastructure) and Agriculture, Mining, Construction and Manufacturing sector (semiconductor manufacturing). It also touches on Scientific Research and Development Services through R&D assessment requirements.

Legislative Status

Hard Law

Legislative Status Summary

This is a Congressional bill that creates binding legal obligations for federal agencies to submit annual reports. It uses mandatory language ('shall submit', 'shall include') and establishes formal reporting requirements enforceable through Congressional oversight.

Actors

Proposer

• Entity Types: AI_Governance_Actor
• Summary: This is a Congressional bill proposed by the United States Congress, as indicated by the header 'enacted by the Senate and House of Representatives of the United States of America in Congress assembled'

Target

• Entity Types: AI_Infrastructure_Provider, AI_Governance_Actor
• Summary: The document targets understanding and monitoring China's semiconductor manufacturing capabilities and AI chipmaking efforts, while also targeting US policy effectiveness through export control assessment. The recommendations are directed at Congress for policy action.

Enforcer

• Entity Types: AI_Governance_Actor
• Summary: The Secretary of Defense is responsible for preparing and submitting the annual reports in consultation with other federal agencies, with Congressional Armed Services Committees providing oversight and enforcement through their review authority.

Monitor

• Entity Types: AI_Governance_Actor
• Summary: The Congressional Armed Services Committees receive and review the annual reports, serving as the primary monitoring body. Additionally, the requirement for public disclosure creates broader monitoring through transparency.

AI Lifecycle Stages

Lifecycle stages covered by the documents, as defined in the OECD Framework for the Classification of AI Systems

• Build and Use Model

AI Lifecycle Summary

The document does not directly govern specific AI system lifecycle stages but rather focuses on monitoring the manufacturing infrastructure (semiconductors) that enables AI development. It addresses the semiconductor manufacturing ecosystem that underpins AI capabilities, with implicit coverage of the 'Build and Use Model' stage through references to AI chipmaking capabilities.

Technical Scope

Terms relating to technical scope that are mentioned or implicitly referenced in the document

No technical scope terms identified.

Technical Scope Summary

The document mentions 'artificial intelligence chipmaking' but does not define or explicitly discuss specific AI system types, model categories, or compute thresholds. The focus is on semiconductor manufacturing infrastructure rather than AI systems themselves.